Thermal & CFD Simulation Engineer (PCB) at Turing

Thermal and CFD Simulation Engineer (PCB) | Remote | Contract, ~13 weeks | Pay not listed

Develop and execute thermal and CFD simulation workflows for PCB assemblies and electronic systems, evaluating heat dissipation, temperature distribution and cooling effectiveness, and generating technically validated simulation evidence. This is a contract engagement through Turing, based in San Francisco.

What the work involves

• Perform thermal analysis of PCB assemblies, electronic components and enclosures.
• Analyse heat conduction, convection and, where applicable, radiation.
• Develop CFD models to evaluate airflow, cooling performance and temperature distribution.
• Run thermal and CFD simulations in OpenFOAM.
• Use Gmsh or equivalent open-source tools for geometry preparation and mesh generation.
• Define thermal boundary conditions, material properties, component power losses and simulation parameters.
• Evaluate component and PCB temperatures, thermal hotspots and cooling effectiveness.
• Develop Python-based automation and post-processing workflows.
• Assess mesh independence, convergence and numerical stability.
• Correlate simulation results with analytical calculations and available reference data.
• Document modelling assumptions, limitations, results and verification evidence.

Required skills

• Strong fundamentals in heat transfer, thermodynamics and fluid mechanics.
• Practical experience in CFD and thermal simulation.
• Knowledge of conduction, natural/forced convection and radiation.
• Experience with OpenFOAM or equivalent CFD tools.
• Familiarity with Gmsh or other mesh-generation tools.
• Understanding of material properties, thermal boundary conditions and heat-source modelling.
• Python scripting for automation and simulation post-processing.
• Ability to interpret simulation results and assess numerical accuracy.

Preferred qualifications

• Bachelor's or Master's degree in Mechanical, Thermal, Aerospace or related engineering.
• 5+ years of relevant experience in CFD, thermal engineering or electronics cooling.
• Experience with PCB thermal analysis, power electronics, semiconductor cooling or electronic enclosures.

Contract details

• Engagement type: contract.
• Start: expected as soon as possible.
• Duration: approximately 13 weeks, with possible extension.
• Commitment: 40 hours per week.
• Hourly rate: not listed.
• Selection process: one AI interview and one interview with the Turing team.