PCB Design Engineer - SI/Thermal Simulation at Turing

PCB Design Engineer (Signal Integrity / Thermal Simulation) | Contract, ~13 weeks | 40 hrs/week | Remote

About the role

Turing, a San Francisco-based company working with frontier AI labs and enterprises deploying advanced AI systems, is hiring a senior hardware design engineer for a contract focused on KiCad-based PCB design and simulation-led redesign. The specialization is Signal Integrity (SI) / Electromagnetic Compatibility (EMC), thermal simulation, or both. The role calls for 8+ years of experience designing, redesigning, simulating, and validating electronic hardware.

What the work involves

• Translate product requirements into circuit architectures, hardware specifications, and validated designs across digital, high-speed, power, analog, mixed-signal, sensor, communication, or RF applications.
• Use KiCad for schematic capture, component selection, multilayer PCB layout, routing, design-rule checks, BOM preparation, and manufacturing documentation.
• Analyze existing PCB layouts and simulation results to identify SI/EMC or thermal issues, determine root causes, and define measurable acceptance criteria.
• Redesign PCB layouts to resolve identified issues while preserving the original schematic, netlist connectivity, and component selection.
• Simulate and assess impedance, reflections, crosstalk, return paths, temperature distribution, heat dissipation, and hotspots.
• Document design decisions, corrective actions, simulation results, and verification findings; support prototype bring-up, debugging, and validation.

Who this is for

• 6+ years of hands-on electronics hardware and PCB design experience, including multilayer layouts and KiCad.
• At least 4 years of practical experience in SI/EMC simulation, thermal simulation, or both, including setup, execution, and interpretation.
• Strong circuit analysis, component selection, datasheet interpretation, grounding, power distribution, signal integrity, thermal management, and DFM/DFT knowledge.
• Ability to correlate simulation results with PCB layout characteristics and assess model inputs, boundary conditions, material properties, and limitations.
• Experience with tools such as Ansys SIwave, HFSS, Cadence Sigrity, Keysight ADS, Ansys Icepak, FloTHERM, COMSOL Multiphysics, OpenFOAM, or equivalent.

Contract details

• Engagement type: contract.
• Length: about 13 weeks, with potential chances of extension.
• Commitment: 40 hours per week.
• Start date: expected to start as soon as possible.
• Selection process: one AI interview and one interview with the team.